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We help clients accelerate innovation to create better consumer experiences in the Internet of Things age that is evolving into the internet of experiences. Find out more.

High-Tech companies have been widely using simulation tools for drop testing, packaging, and lifecycle prediction. From consumer electronics to control and telecommunications systems, high-tech goods are no longer simply products that people own but are instruments of change in how we live. Connectivity and intelligence are turning them into personal and professional experiences.

The Internet of Things (IoT) enables what is called the Internet of Experiences where a new class of cross-industry usages and business models go beyond physical products to include software, big data intelligence, networks and content ecosystems.

Manufacturers will benefit from our full range of simulation capabilities.

VIAS3D provides integrated, innovative, and cost-effective engineering and software solutions to simulate the behavior of advanced material models for electronics applications, modern progressive fracture/failure capabilities, best-in-class solver performance, and interactive capabilities in order to make model generation and preparation more efficient.

Solutions and Applications

  • Acoustics
  • Circuit Boards
  • Computers & Peripherals
  • Hand-held Devices
  • Microelectro-mechanical Systems
  • Paper Feeding
  • Semiconductor

Realistic Simulation & Validation Analysis

  • Thermal flow/cooling
  • Drop test
  • Heat transfer
  • Noise/Acoustic
  • Thermo-mechanical
  • Vibration
  • Electromagnetic compliance
  • Structural analysis
  • Electrostatic analysis

Our team is capable of performing analysis of thermal, electrical, mechanical (both static and dynamic) and moisture-sensitivity load regimes.

High-Tech Clients

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Regus CBD
L-9, Raheja Towers, East Wing
26/27, M G Road Bengaluru 560 001

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